ANDANTA GMBH
InGaAs matrix sensors cooled
Two-dimensional Near-Infrared (NIR) Focal Plane Arrays (FPA) embedded in a Kovar package with a one- or two-stage thermoelectric cooler
Optoelektronische Bildsensoren für wissenschaftliche Anwendunge
InGaAs matrix sensors cooled
Two-dimensional Near-Infrared (NIR) Focal Plane Arrays (FPA) embedded in a Kovar package with a one- or two-stage thermoelectric cooler
InGaAs matrix sensors uncooled
Two-dimensional Near-Infrared (NIR) Focal Plane Arrays (FPA) integrated in a ceramic housing without a cooler
InGaAs linear sensors cooled
One-dimensional Near-Infrared (NIR) Linear Detector Array (LDA) installed in a Kovar housing, available with a one-stage thermoelectric cooler
InGaAs linear sensors uncooled
One-dimensional Near-Infrared (NIR) Linear Detector Array (LDA) installed in a ceramic housing without a cooler
Si-CCD sensors highest resolution
High-resolution silicon image sensors for the ultraviolet to near infrared spectral range (customized)
X-ray Si-CCD
Customized Charged Coupled Devices for the direct detection of X-rays
Curved Si-CCD
Silicon Time Delay Integration image sensors as customized special developments
Custom Si-TDI image sensors
Silicon Time Delay Integration image sensors as customized special developments
We have more than 40 years experience in development, manufacturing and sales of opto-electronic detectors and emitters.
Please contact us – we will be glad to consult you in the selection of applicative detector solutions or develop, together with our partners, individual custom products.
Our Products
For use in NIR (near-infrared) spectroscopy, interferometry (rectangular pixels) and for web inspection (square pixels), 512 x 1 (25 μm pixels) to 2048 x 1 (12.5 μm pixels).
For establishing a conductive connection (hybridization) between a photodiode array and a silicon CMOS readout integrated circuit (ROIC) to complete a NIR (near-infrared) image sensor assembly.
Linear InGaAs sensors ♦ IR-extended 1.9 µm InGaAs-FPAs ♦ Flip-Chip bond servicesPDF ➦